Electronical components
| In many cases, small features of electronic components must be checked 100% dimensionally. The specific requirements for sensors and resolution are very different and must be checked in each specific case, so that specific advice and tests are necessary to select a suitable combination of sensor and lens. Inline solutions are often used. The advantages are the SDK, which enables the sensors to be easily integrated into customer-specific applications, and the high measurement speed, which minimizes the influence of environmental conditions. | contact person: Matthias Liedmann phone: +49 (0) 3677-83710-54 email: sales@gbs-ilmenau.de |
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solder bumps
Subsequent process steps require a high degree of parallelism of the soldering points to achieve stable contacting. Similar tasks require different optimizations, depending on the size of the balls and components as well as the use for develop-ment tasks in process optimization or faster 100%, different system configurations are used.
