turned precision parts

High-performance profilometers have now the necessary speed to carry out several 100 individual measurements and stitch them together in a few minutes. This allows the scanning of several cm² with a higher resolution as possible with stylus instruments. 3D measurements show results at a glance that cannot possibly be obtained with a single profile section. At the same time, 2d roughness parameters can be determined according to the standards for stylus instruments. Decades of experience can still be used and supplemented with new knowledge. This simplifies the quality assurance and the improvement of manufacturing processes.

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super polished mirror surface

The demands on surfaces are constantly increasing and the reliable determination of roughness parameters below 1 nm is necessary to ensure polishing processes, especially in the field of semiconductor and optics. Improved procedures in the area of sensor calibration and data acquisition take this into account and minimize system noise without loss of lateral resolution.





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PCD cutting tools

PCD (poly crystalline diamond) tools are build from a PCD segment consisting out of diamond particles with a seize of typically 2 – 30 µm and a metal binder (usually Cobalt). This enables the production of very sharp edges, whereby sharpness and chipping have a major influence on the service live. The evaluation of the edge geometries requires very high-resolution measurements. This measurement was done within a short scanning time using the smartWLI extended range equipped with a 50x objective.

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planarity of solder points

Modern microchips often have a large number of solder points. For a reliable connection to the circuit board, they must have a defined height above the chip. Since the highest point is not necessarily exactly in the middle of the soldering point, high-resolution 3D measurements are required to measure them. MountainsMap's particle analysis has the necessary functions to identify missing or faulty solder points.

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Nanostructures

The systems smartWLI compact and smartWLI nanoscan can scan nano structures on larger areas with sub atomic height resolution and point densities down to 0.03 µm.

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spiral staircase

EPSI (Extended Phase Shift Interferometry) combines the advantages from VSI (Vertical Scanning Interferometry) - unlimited z range but lower height resolution – and PSI (Phase Shift Interferometry) extreme height resolution but to λ/2 half limited z range.

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Wear measurement

Wear marks can be quickly measured with the smartWLI systems in high resolution. The high resolution reduces the test effort, since even small changes in the surface topography can be easily quantified.

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Blasted surface

Optimized algorithms allow the scanning of surfaces with a high aspect ratio – small structures with high inclined flanks. The high speed enables the user the survey of smallest details over large areas.

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Measurement of cutting edges

The combined evaluation of geometry and surface structures of cutting edges is important to understand the cutting-edge preparation in detail and to optimize the production processes.

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Sheet metal surface measurements

The sheet metal forming has high requirements on the micro structures as well as on the waviness of the raw material. Parameters as Wa with evaluation length of 50 mm and tolerances of parts from a micrometer require the combination of an fast scanning process with, an nm accuracy and a dedicated software with all necessary algorithms implemented.

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